Electroless plating equipment for UBM formation for wafers
Plating chemicals, total proposals for surface treatment processes and equipment, electroless plating equipment for UBM formation for wafers.
Leveraging the know-how acquired as a surface treatment and plating chemicals manufacturer, we designed and developed the electroless plating system "TORYZA EL SYSTEM" for UBM formation in collaboration with equipment manufacturers. Along with the plating process "TORYZA EL PROCESS" for UBM formation on aluminum electrodes on wafers, we offer a comprehensive proposal for plating chemicals, surface treatment processes, and equipment for semiconductor back-end processes.
- Company：奥野製薬工業 大阪・放出、東京、名古屋など
- Price：Other
